| 1 | Electric Intelligence DevelopmentBasic Technology Development(Ministry of Knowledge Economy) | Development of Megasonic Cleaning Module | 2006.11.01~2011.10.31 | - Cleaning Technology for 32 nm of semi-conduct wafer by minimized pattern damage- Result : DURATWIN unit | -세메스 납입- Applied to Samsung Electrics Co., Ltd.
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| 2 | Technology in Gyeonggi Development(GBSA) | Cleaning System Development through Vibration Jet of High Frequency Wave | 2010.07.01~2012.06.30 | - Dry Cleaning Technology for over 3 ㎛ of contaminant on the panel surface during the process- Cleaning area improvement compared with the existing cleaning of effective area-Result : SLIM USC | -LG Display 납입-LG 이노텍 납입
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| 3 | Technical Development Support for Medium and Small-sized Enterprises(Ministry of SMEs and Startups) | Etching Device for Cell Wafer of solar battery | 2010.06.01~2012.05.31 | Final cleaning device to preform concurrent cleaning and etching for solar wafer | MEMC Solar Dept. 장비납입
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| 4 | R&D Center of Excellent Manufacturing Technology(Ministry of Knowledge Economy) | Ultrasonic Cleaning Technology through Multiple Vibration Mode | 2011.05.01~2015.04.30 | 다 Unified Cleaning Technology using various ultrasonic vibration mode to maintain unified sound pressure in cleaning water | Applied Technology to Product Development
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| 5 | Technical Development Support for Medium and Small-sized Enterprises(Ministry of SMEs and Startups) | Cleaning Technology for Solar Cell Wafer through micro bubble resonance | 2012.06.01~2014.05.30 | Cleaning Technology and Equipment for solar wafer through ultrasonic by generating micro bubble resonance | - Commercialized for bubble generation device- Samsung Electrics Co.,Ltd 납입
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| 6 | Technology in Gyeonggi Development(GBSA) | Cleaning Technology for Circuit board through Micro Droplet | 2016.09.01~2017.08.31 | Unified Cleaning Technology using constant size of droplet to emit vibration through Piezo at the top of micro-roll (10~100㎛ nozzle) |
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| 7 | Technical Development Support for Medium and Small-sized Enterprises(Ministry of Knowledge Economy) | Ultrasonic Welding Device to select welding mode of 100㎛ amplitude | 2017.05.01~2019.04.30 | Device development for metal welding by transducer and actuator with over 100㎛ of high amplitude | |
